Reflow Oven T-962 v2.0, 110V 800W Reflow Soldering Station, Micro-computer Control Reflow Soldering Machine with 7.1x9.3 Inch Soldering Area

Item Number(700001): 110V 800W Reflow Oven T-962 v2.0

• Technical Parameter: Power supply: AC110V/ 50~60Hz, rated power: 800W, drawer panel area: 7.1x9.3Inch (180x235mm), temperature range: 0℃-280℃, cycle time: 1～8 min, rated duty cycle: 100%
• High-Capacity Processing: Features a large 180x235mm (7.1"x9.3") infrared heating zone with forced-air convection, enabling uniform temperature distribution (±2°C) for lead-free (max 280°C) and standard soldering applications
• Integrated Fume Extraction System: Equipped with rear-mounted exhaust interface(suitable for Φ 110mm smoke exhaust pipe) ensures zero toxic fume leakage, maintaining health-compliant workspace conditions
• Multiple Temperature Curve Selection: The reflow oven features eight preloaded temperature profiles and supports manual heating/forced convection cooling modes. All soldering processes execute automatically with user-friendly operation
• Wide Application: Our machine can processes single/double-layer PCBs with fine-pitch components (CHIP, SOP, PLCC, QFP, BGA). Ideal for R&D, prototyping, and low-volume SMT production